Fujiboehime Online

      Product Catalog

      For inquiries regarding prices and purchases, please feel free to contact us via "Contact Us" at the top of the page.

       

      Brand Series Product Number Size (mm) Product Description Product Photo
      NEXTILE T Series T4 260φ
      This is a diamond abrasive embedded type grinding pad developed for grinding glass, quartz, SiC, and various ceramics. It features low environmental impact as it does not require abrasives (slurry). NEXTILE T4 contains diamond abrasives equivalent to 4um, which reduces the burden on the next process with low Ra and low scratches.
      NEXTILE T Series T4 300φ
      NEXTILE T Series T4 360φ
      NEXTILE T Series T4 400φ
      NEXTILE T Series T4 800φ
      NEXTILE T Series T4 910(370)φ
      NEXTILE T Series T4 920(360)φ
      NEXTILE T Series T4 933(349)φ
      NEXTILE T Series T4 1070(350)φ
      NEXTILE T Series T4 1170(630)φ
      NEXTILE T Series T4 1380(460)φ
      NEXTILE T Series T4 1480(470)φ
      NEXTILE T Series T4 2200(680)φ
      NEXTILE T Series T9 260φ
      This is a diamond abrasive embedded type grinding pad developed for grinding glass, quartz, SiC, and various ceramics. It features low environmental impact as it does not require abrasives (slurry). NEXTILE T9 contains diamond abrasives equivalent to 9um, which is effective in reducing processing time.
      NEXTILE T Series T9 300φ
      NEXTILE T Series T9 360φ
      NEXTILE T Series T9 400φ
      NEXTILE T Series T9 800φ
      NEXTILE T Series T9 910(370)φ
      NEXTILE T Series T9 920(360)φ
      NEXTILE T Series T9 933(349)φ
      NEXTILE T Series T9 1070(350)φ
      NEXTILE T Series T9 1170(630)φ
      NEXTILE T Series T9 1380(460)φ
      NEXTILE T Series T9 1480(470)φ
      NEXTILE T Series T9 2200(680)φ
      NEXTILE U Series U1 920(360)φ NEXTILE U1 is designed as a substitute pad for metal plates, specializing in chemical resistance and wear resistance for lapping processes.
      It is particularly effective when used with diamond slurry for difficult-to-machine materials such as SiC substrates and single crystal sapphire substrates, achieving excellent removal rates, flatness, and a finish close to a mirror surface in lapping processes.
      NEXTILE U Series U3 920(360)φ NEXTILE U3 is a lapping pad that excels in balancing polishing rate and finish. By combining U3 with slurry particle sizes for SiC, sapphire, GaN, and ceramic materials, it can achieve any desired removal amount and finish. Additionally, it is a long-life pad with high wear resistance despite being thin, outperforming conventional products.
      POLYPAS FX Series FX5LR 1000×1000 This is a filler embedded type polishing pad developed for polishing LCD glass substrates, glass discs, optical lenses, etc.
      POLYPAS FXA Series FXA9H 1000×1000 This is a non-filler type hard polyurethane pad that can be used for various applications such as primary polishing of semiconductor wafers and polishing of quartz crystal optical lenses.
      POLYPAS FP Series FP55 1000×1000 This is a non-woven type abrasive developed for stock removal of silicon wafers, semiconductor materials, optical lenses, metals, etc.
      POLYPAS SP Series H7058NX 1000×1000 The SP series is a polishing pad for final polishing (finishing polishing) of semiconductor wafers, hard disks, etc.
      POLYPAS BP Series BPX222A 1000×1000 This product is developed to hold semiconductor silicon wafers and LCD glass substrates without wax. You can select the optimal holding pad for polishing conditions, achieving the highest level of flatness performance. There are two types: a frame-less insert type and a frame type template, with a rich lineup of various types available.