NEXTILE U3 is a wrapping processing pad that excels in the balance between grinding rate and finish. By combining U3 with slurry particle size, it can achieve any desired removal amount and finish for materials such as SiC, sapphire, GaN, and ceramics. Additionally, despite being thin, it has high wear resistance and offers a longer life compared to conventional products.
NEXTILE U3 is a wrapping processing pad that excels in the balance between grinding rate and finish. By combining U3 with slurry particle size, it can achieve any desired removal amount and finish for materials such as SiC, sapphire, GaN, and ceramics. Additionally, despite being thin, it has high wear resistance and offers a longer life compared to conventional products.
